Assembler: 143029

Position Responsibilities
*This position performs fabrications and modification tasks as well as wire and ribbon bonding of various sizes. It will also require the capability to troubleshoot defective hybrid circuit card assemblies by visually screening wire bonds or chip placement.Basic Qualifications:
*High School Diploma required
*Experience in wire bonding and ribbon bonding (0.001” and 0.0007” wire and various sizes of ribbon)
*Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers and other similar tools
*Good dexterity and eye/hand coordination
*Experience in microelectronics assembly (chip and wire assembly)
*Ability to read and work from detailed work instructions and drawings; computer skills are required to support retrieval of drawings and work instructions as well as other job activities
*Ability to work in a diverse team environment; Good interpersonal, teaming and communication skills Job Duties
*Capability to troubleshoot defective hybrids circuit card assemblies by visually screening wirebonds or chip placement.
*Installation of substrates and components in highly complex microwave assemblies using paste and sheet epoxies.
* The utilization of measurement equipment (e.g. reticle, drop indicator, bond puller) to check parameters during and after work completion to assure that the unit conforms to specifications.
*Plans work sequence by assessing work in progress to schedule requirements.
*Collaboration with Manufacturing and Quality Engineering on procedures and troubleshooting methodologies.Desired Skills:
*Experience in hybrid assembly in accordance with Mil STD 883
*Experience wire bonding or ribbon bonding to ceramic or duroid substrates
*Experience using Westbond and Metcal bonding machines and Unitech welder.
*Experience in substrate and component attach, auto pick-and-place
*Experience operating auto or manual bonding equipment
*Familiarity working in an ESD and FOD controlled environment
*Experience in mechanical assembly processes of small electronic devices
*Experience working on military products in ISO 9001 / AS9100 controlled environments